Skip to Main Content
Skip Nav Destination

Just Accepted Manuscript

Research-Article April 28, 2021
Microstructure and Properties of Nb Nanoparticles Reinforced Sn-0.7Cu Solder Alloy
J. Electron. Packag. doi: https://doi.org/10.1115/1.4051025
Research-Article April 24, 2021
Numerical Modeling of the Wave Soldering Process and Experimental Validation
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050981
Research-Article April 20, 2021
Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050898
Research-Article April 13, 2021
Fatigue Testing of Copper Nanoparticle Based Joints and Bonds
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050871
Research-Article March 15, 2021
Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050512
Research-Article March 1, 2021
Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050696
Review Articles March 1, 2021
Underfill Flow in Flip-Chip Encapsulation Process: A Review
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050697
Research-Article February 16, 2021
Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-layered Stacked-chip Packaging
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050198
Research-Article February 16, 2021
Sensitivity-Coefficient Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050200
Research-Article February 16, 2021
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-emitting Diodes Using an SiO2/Graphite Bi-layered Packaging Structure
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050202
Review Articles February 4, 2021
Spray Cooling On Enhanced Surfaces: a Review of the Progress and Mechanisms
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050046
Review Articles January 29, 2021
A Review On Transient Thermal Management of Electronic Devices
J. Electron. Packag. doi: https://doi.org/10.1115/1.4050002
Research-Article January 19, 2021
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
J. Electron. Packag. doi: https://doi.org/10.1115/1.4049815
Research-Article January 19, 2021
Reliability Analysis of Solder Joints on Rigid-Flexible PCB for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads with Continuously Monitored Electrical Signals
J. Electron. Packag. doi: https://doi.org/10.1115/1.4049813
Close Modal

or Create an Account

Close Modal
Close Modal