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Research-Article August 7, 2020
Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-LEDs Combined with the Centrifugation Technique
J. Electron. Packag. doi: https://doi.org/10.1115/1.4048034
Research-Article August 7, 2020
Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor
J. Electron. Packag. doi: https://doi.org/10.1115/1.4048036
Guest Editorial August 7, 2020
Guest Editorial: Interpack 2019
J. Electron. Packag. doi: https://doi.org/10.1115/1.4048039
Review Articles August 7, 2020
State-of-the-art of Lead-free Solder-Joint Reliability
J. Electron. Packag. doi: https://doi.org/10.1115/1.4048037
Review Articles August 7, 2020
Review of Methodologies for Structural Integrity Evaluation of Power Modules
J. Electron. Packag. doi: https://doi.org/10.1115/1.4048038
Research-Article August 7, 2020
Reliability Evaluation of Flexible Hybrid Electronics Systems Considering Degradation Behavior Under Multi-Stress Operating Conditions
J. Electron. Packag. doi: https://doi.org/10.1115/1.4048035
Review Articles August 6, 2020
A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones
J. Electron. Packag. doi: https://doi.org/10.1115/1.4048011
Research-Article July 22, 2020
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 2 - Parametric Study of EMMCs for High Heat Flux (~1 kW/cm2) Power Electronics Cooling
J. Electron. Packag. doi: https://doi.org/10.1115/1.4047883
Research-Article July 21, 2020
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1 - Experimental Study of Single-phase Cooling Performance with R245fa
J. Electron. Packag. doi: https://doi.org/10.1115/1.4047846
Research-Article July 21, 2020
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel 3D-Manifold Coolers (EMMC): Part 3 - Addressing Challenges in Laser Micro-Machining Based Manufacturing of 3D-Manifolded Micro-Cooler Devices
J. Electron. Packag. doi: https://doi.org/10.1115/1.4047847
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