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About the Journal


Purpose
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems

Diversity and Inclusion The Technical Committee on Publications and Communications endorses the commitment of ASME to support diversity and to create and ensure inclusive and ethical practices for publishing as well as the science and engineering professions.

Frequency: Quarterly

ISSN: 1043-7398
eISSN: 1528-9044
CODEN: JEPAE4

Title History
Journal of Electronic Packaging (ISSN: 1043-7398), 1989 - Present

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Impact Factor: 1.787
2019 Journal Citation Reports ®
(Clarivate Analytics, 2019)

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