Search Results | ASME Digital Collection

1-20 of 24

Sort by

Sort Order Select

Proceedings Papers

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 227-242, November 16–21, 1997

Paper No: IMECE1997-0822

DOI: https://doi.org/10.1115/IMECE1997-0822

View Paper

Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure

Proceedings Papers

A Viscoplasticity Model for Solder Alloys

Yongchang Lee, Cemal Basaran

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 309-316, November 12–18, 2010

Paper No: IMECE2010-37106

DOI: https://doi.org/10.1115/IMECE2010-37106

View Paper

Topics: Alloys, Solders, Viscoplasticity, Creep, Stress, Diffusion processes, Dislocation motion, Electronic packaging, Grain size, Reliability

Journal Articles

A Creep Model for Solder Alloys

Yongchang Lee, Cemal Basaran

J. Electron. Packag. December 2011, 133(4): 044501.

DOI: https://doi.org/10.1115/1.4005288

Published Online: November 17, 2011

View Article

Topics: Alloys, Creep, Solders

Journal Articles

Introduction for JEP Special Issue on Carbon Nanotubes

Tarek Ragab, Dr., Cemal Basaran, Dr.

J. Electron. Packag. June 2011, 133(2): 020301.

DOI: https://doi.org/10.1115/1.4004324

Published Online: July 1, 2011

View Article

Topics: Carbon nanotubes, Electronic packaging, Chirality, Electron field emission, Nanoelectronics, Strength (Materials)

Journal Articles

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

Tarek Ragab, Cemal Basaran

J. Electron. Packag. June 2011, 133(2): 020903.

DOI: https://doi.org/10.1115/1.4003866

Published Online: June 7, 2011

View Article

Topics: Atoms, Carbon nanotubes, Chain, Displacement, Failure, Molecular dynamics simulation, Nanotubes, Simulation, Single-walled carbon nanotubes, Stress

Proceedings Papers

Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

Bicheng Chen, Cemal Basaran

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 193-200, July 19–23, 2009

Paper No: InterPACK2009-89014

DOI: https://doi.org/10.1115/InterPACK2009-89014

View Paper

Topics: Copper, Heating, Interferometry, Joules, Heat, Current density, Design, Electrodiffusion, Electronic packaging, Energy dissipation

Proceedings Papers

Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension

Cemal Basaran, Tarek Ragab

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 513-516, July 19–23, 2009

Paper No: InterPACK2009-89005

DOI: https://doi.org/10.1115/InterPACK2009-89005

View Paper

Topics: Carbon, Damage mechanics, Nanotubes, Tension, Stress, Single-walled carbon nanotubes, Boundary-value problems, Computation, Displacement, Molecular dynamics simulation

Proceedings Papers

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

Bicheng Chen, Cemal Basaran

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 647-654, July 19–23, 2009

Paper No: InterPACK2009-89016

DOI: https://doi.org/10.1115/InterPACK2009-89016

View Paper

Topics: Interferometry, Nanoscale phenomena, Wavelet transforms, Resolution (Optics), Tensors, Accelerated life testing, Ball-Grid-Array packaging, Computer software, Design, Dynamic testing (Materials)

Proceedings Papers

Electromigration Damage Mechanics of Interconnects

Cemal Basaran, Minghui Lin

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 83-94, July 19–23, 2009

Paper No: InterPACK2009-89006

DOI: https://doi.org/10.1115/InterPACK2009-89006

View Paper

Topics: Damage mechanics, Electrodiffusion, Damage, Nanoelectronics, Boundary-value problems, Current density, Diffusion (Physics), Copper, Materials degradation, Plasticity

Journal Articles

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Mohd F. Abdulhamid, Cemal Basaran

J. Electron. Packag. March 2009, 131(1): 011002.

DOI: https://doi.org/10.1115/1.3068296

Published Online: February 11, 2009

View Article

Topics: Annealing, Lead-free solders, Mechanical properties, Solder joints, Solders, Temperature gradient, Tin, Testing, Elastic moduli, Nanoindentation

Proceedings Papers

Experimental Damage Mechanics of Microelectronic Solder Joints Under Fatigue Loading

Cemal Basaran, Hong Tang, Shihua Nie

Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 229-236, November 17–22, 2002

Paper No: IMECE2002-32849

DOI: https://doi.org/10.1115/IMECE2002-32849

View Paper

Topics: Damage mechanics, Fatigue, Solder joints, Damage, Stress, Ball-Grid-Array packaging, Elastic moduli, Fatigue damage, Fatigue life, Materials degradation

Proceedings Papers

Irreversible Thermodynamics for Damage Mechanics of Solid Materials

Cemal Basaran, Shihua Nie

Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 193-198, November 17–22, 2002

Paper No: IMECE2002-32937

DOI: https://doi.org/10.1115/IMECE2002-32937

View Paper

Topics: Damage mechanics, Nonequilibrium thermodynamics, Damage, Entropy, Solids

Proceedings Papers

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Hua Ye, Cemal Basaran, Douglas Hopkins

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 477-483, November 17–22, 2002

Paper No: IMECE2002-33650

DOI: https://doi.org/10.1115/IMECE2002-33650

View Paper

Topics: Flip-chip, Flip-chip devices, Solder joints, Electrodiffusion, Temperature, Solders, Anodes, Current density, Damage, Nanoindentation

Proceedings Papers

Elastic Modulus of Pb/Sn Solder Joints in Microelectronics

Cemal Basaran, Jianbin Jiang

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 141-150, November 17–22, 2002

Paper No: IMECE2002-39632

DOI: https://doi.org/10.1115/IMECE2002-39632

View Paper

Topics: Elastic moduli, Microelectronic devices, Solder joints, Tin, Alloys, Solders, Crystals, Deformation, Elasticity, Grain size

Proceedings Papers

Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging

Cemal Basaran, Hong Tang

Proc. ASME. IMECE2002, Applied Mechanics and Biomedical Technology, 61-68, November 17–22, 2002

Paper No: IMECE2002-32874

DOI: https://doi.org/10.1115/IMECE2002-32874

View Paper

Topics: Damage mechanics, Microelectronic packaging, Solders, Damage, Ball-Grid-Array packaging, Thermomechanics, Alloys, Constitutive equations, Engineering simulation, Fatigue

Proceedings Papers

Thermomigration Induced Strain Field Simulation for Microelectronic Lead Free Solder Joints

Shidong Li, Minghui Lin, Mohd F. Abdulhamid, Cemal Basaran

Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 235-239, November 5–10, 2006

Paper No: IMECE2006-13046

DOI: https://doi.org/10.1115/IMECE2006-13046

View Paper

Topics: Lead-free solders, Simulation, Stress, Electronic equipment, Diffusion (Physics), Displacement, Failure, Finite element analysis, Materials properties, Shock (Mechanics)

Proceedings Papers

Length Scale in Solder Joints Materials

Juan Gomez, Cemal Basaran

Proc. ASME. IMECE2006, Applied Mechanics, 1-8, November 5–10, 2006

Paper No: IMECE2006-13206

DOI: https://doi.org/10.1115/IMECE2006-13206

View Paper

Topics: Alloys, Aluminum, Constitutive equations, Copper, Nickel, Plasticity, Solder joints, Solders, Strain gradient, Tin

Proceedings Papers

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

Mohd F. Abdulhamid, Cemal Basaran, Douglas C. Hopkins

Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 53-57, November 5–10, 2006

Paper No: IMECE2006-13119

DOI: https://doi.org/10.1115/IMECE2006-13119

View Paper

Topics: Intermetallic compounds, Nanoelectronics, Solder joints, Solders, Temperature gradient, Tin

Journal Articles

Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

Juan Gomez, Cemal Basaran

J. Electron. Packag. June 2007, 129(2): 120–128.

DOI: https://doi.org/10.1115/1.2721082

Published Online: October 4, 2006

View Article

Topics: Alloys, Nanoindentation, Plasticity, Solders, Strain gradient, Microelectronic devices

Journal Articles

Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

Cemal Basaran, Associate Professor, Yujun Wen, Ph.D. Candidate

J. Electron. Packag. September 2003, 125(3): 426–430.

DOI: https://doi.org/10.1115/1.1602707

Published Online: September 17, 2003

View Article

Topics: Ball-Grid-Array packaging, Finite element analysis, Modeling, Reliability, Solder joints, Solders, Temperature, Tin, Surface mount technology, Diffusion (Physics)

Journal citation

NARROW

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

A Viscoplasticity Model for Solder Alloys

A Creep Model for Solder Alloys

Introduction for JEP Special Issue on Carbon Nanotubes

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

Electromigration Damage Mechanics of Interconnects

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Experimental Damage Mechanics of Microelectronic Solder Joints Under Fatigue Loading

Irreversible Thermodynamics for Damage Mechanics of Solid Materials

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Elastic Modulus of Pb/Sn Solder Joints in Microelectronics

Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging

Thermomigration Induced Strain Field Simulation for Microelectronic Lead Free Solder Joints

Length Scale in Solder Joints Materials

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only